PCB Capabilities

From standard FR4 to advanced HDI — delivering to your exact specifications.

PCB Fabrication Specifications

Parameter	Capability
Board Material	FR4, High-Tg FR4, Rogers, Aluminum, Copper Base, Halogen-Free, PTFE
Number of Layers	1 – 40 layers
Board Thickness	0.2mm – 5.0mm
Copper Weight	0.5 oz – 20 oz
Min Trace / Space	2.5 / 2.5 mil (HDI) 3 / 3 mil (standard)
Min Mechanical Drill	0.15mm
Min Laser Drill (HDI)	0.1mm
HDI Structure	Up to 3rd order HDI Any-layer HDI available
Surface Finish	HASL (Lead / Lead-Free), ENIG, ENEPIG, Immersion Silver, Immersion Tin, OSP, Hard Gold, Selective Gold
Solder Mask	Green, Black, Blue, Red, White, Yellow, Matte Black, Matte Green
Silkscreen	White, Black, Yellow
Max Board Size	600 × 1,200 mm
Min Board Size	5 × 5 mm
Controlled Impedance	±5% tolerance
IPC Standard	IPC Class 2 & Class 3
Bow & Twist	≤ 0.5%
Via Types	Through-hole, Blind, Buried, Micro via, Via-in-pad
Special Processes	Back drill, Countersink, Peelable mask, Carbon ink, Via filling
Testing	100% E-test (Flying probe or fixture), AOI, X-ray

Material Highlights

Materials for standard, RF and thermal designs

Standard FR4

The industry standard for most applications. Available in standard Tg (130–140°C) and High-Tg (170°C+) for demanding thermal environments.

High-Frequency Materials

Rogers 4003C, 4350B, RO3003, Taconic, and PTFE laminates for RF, microwave, and antenna applications requiring precise dielectric properties.

Metal Core (MCPCB)

Aluminum and copper base boards for LED lighting, power electronics, and high-heat applications requiring superior thermal dissipation.

HDI Capabilities

HDI — High Density Interconnect

Supporting up to 3rd Order HDI with laser-drilled microvias.

HDI Orders

1st Order HDI
1 build-up layer each side
Blind & buried vias
2nd Order HDI
2 build-up layers each side
Stacked or staggered microvias
3rd Order HDI
3 build-up layers each side
Maximum routing density
Suitable for advanced mobile, wearable, and medical devices

HDI Applications

Smartphones & tablets
Wearable electronics
Medical devices
Aerospace & defense
High-performance computing
Advanced automotive ECUs

HDI Specs

Min laser drill: 0.1mm
Min microvia pad: 0.25mm
Min line/space: 2.5/2.5 mil
Registration: ±0.05mm
Via-in-pad: ✓ Available
Any-layer HDI: ✓ Available

Special Processes

Advanced fabrication capabilities

Controlled Impedance

Single-ended and differential pair impedance control to ±5% tolerance, with TDR test report available.

Back Drilling

Removes stub from through-hole vias to reduce signal reflection — essential for high-speed PCBs above 10 Gbps.

Via-in-Pad

Filled and capped vias under SMD pads for BGA and fine-pitch components, enabling compact board designs.

Heavy Copper

Up to 20 oz copper for power electronics, busbars, and high-current applications requiring superior current carrying capacity.

Rigid-Flex

Combined rigid and flexible sections in a single board — ideal for 3D assemblies, wearables, and space-constrained designs.

Embedded Components

Resistors and capacitors embedded within board layers to reduce surface component count and improve electrical performance.

Quality & Certification

Built to recognized PCB standards

IPC-A-600 — Acceptability of PCBs IPC Class 2 & 3 RoHS Compliant REACH Compliant

Full material traceability and test reports available upon request for every order.

Don't see your specification listed?

We work with a wide range of materials and processes. Send us your Gerber files and requirements — we'll get back to you within 24 hours.

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PCB Assembly (PCBA) Capabilities

SMT Assembly

Surface mount technology for components down to 0201 (imperial) package size. High-speed pick and place with precise solder paste printing and reflow profiling.

Through-Hole Assembly

Manual and automated THT insertion for connectors, transformers, capacitors, and other leaded components. Wave soldering and selective soldering available.

Mixed Assembly

Combined SMT and THT assembly on the same board. Top and bottom side SMT with subsequent through-hole insertion and soldering.

Assembly Specifications

Parameter	Capability
Min Component Size	0201 (imperial) / 0.6×0.3mm
BGA Pitch	Min 0.3mm pitch
Max Component Height	25mm
Max Board Size	600 × 500mm
Min Board Size	50 × 50mm
Placement Accuracy	±0.03mm
Solder Paste	Lead-free (SAC305) & Leaded
Reflow	Nitrogen reflow available
Wave Soldering	✓ Available
Selective Soldering	✓ Available
Hand Soldering	✓ Available (fine pitch)
Double-Sided Assembly	✓ Available
Conformal Coating	✓ Available
Underfill	✓ Available (BGA / CSP)
Press-Fit Assembly	✓ Available
Cable & Wire Harness	✓ Available

Inspection & Testing

Inspection & Quality Control

Every board inspected before it leaves — zero-defect delivery is our standard.

Automated Optical Inspection (AOI)

100% AOI on all SMT assemblies. Detects missing components, misalignment, solder bridges, and polarity errors.

X-Ray Inspection

2D and 3D X-ray for BGA, QFN, and hidden solder joint verification. Critical for high-density and fine-pitch assemblies.

In-Circuit Test (ICT)

Electrical verification of component values, placement, and solder joint integrity using bed-of-nails fixture.

Functional Testing (FCT)

Power-on functional testing to your test specification. Custom test fixture development available.

BGA Rework & Reballing

Precision BGA removal, reballing, and replacement. X-ray verified before and after rework.

First Article Inspection (FAI)

Full dimensional and functional verification on first production unit before full run proceeds.

Process Flow

Our Assembly Process

Gerber & BOM Review

DFM and DFA check before production starts.

Component Procurement

Sourcing from authorized distributors with full traceability.

Solder Paste Printing

Automated stencil printing with SPI (Solder Paste Inspection).

SMT Placement

High-speed pick and place, down to 0201 components.

Reflow Soldering

Nitrogen reflow with optimized thermal profiling.

THT & Hand Soldering

Through-hole insertion and selective/wave soldering.

AOI & X-Ray Inspection

100% optical and X-ray verification of all joints.

Functional Testing

Power-on test to your specification.

Final QC & Packing

Visual inspection, cleaning, and secure packaging.

PCBA Quality & Standards

Assembly quality documentation available

IPC-A-610 — Acceptability of Electronic Assemblies IPC Class 2 & Class 3 RoHS & Lead-Free Compliant REACH Compliant

Full assembly reports, X-ray images, AOI results, and component traceability documentation available upon request.

Ready to assemble your board?

Send us your Gerber files and BOM — we'll review and quote within 24 hours.

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