Cost Effective
The most competitively priced PCB substrate available. Mature global supply chain and high production volumes keep costs low without compromising quality.
FR4 PCB
The industry standard — reliable, versatile, and cost-effective for the widest range of applications.
FR4 is the most widely used substrate material in the printed circuit board industry. Composed of woven fiberglass cloth with an epoxy resin binder, FR4 offers an excellent combination of electrical insulation, mechanical strength, moisture resistance, and flame retardancy — making it the default choice for the vast majority of electronic applications.
Standard Tg FR4 (glass transition temperature 130–140°C) is suitable for most commercial and consumer electronics where operating temperatures are moderate. For applications requiring greater thermal stability, High-Tg FR4 (170°C+) maintains its mechanical and electrical properties at elevated temperatures, reducing the risk of delamination and improving long-term reliability.
FR4 boards can be manufactured in 1 to 40 layers, with copper weights from 0.5 oz to 4 oz, and a wide range of surface finishes including HASL, ENIG, OSP, Immersion Silver, and Hard Gold. Whether you need a simple 2-layer prototype or a complex 20-layer production board, FR4 provides the consistent, predictable performance that engineers and manufacturers rely on.
As the most produced PCB type globally, FR4 benefits from the most mature manufacturing processes, shortest lead times, and most competitive pricing — making it the natural starting point for any new design.
Key Advantages
Key Advantages
Excellent Electrical Insulation
FR4 provides consistent dielectric properties (Dk ~4.5) suitable for the majority of digital, analog, and mixed-signal circuit designs operating at standard frequencies.
High Mechanical Strength
Woven fiberglass reinforcement gives FR4 boards excellent rigidity and resistance to mechanical stress during assembly, handling, and throughout the product lifecycle.
Moisture & Flame Resistant
The 'FR' in FR4 stands for flame retardant. The material self-extinguishes when exposed to flame and resists moisture absorption, meeting UL94 V-0 flammability rating.
Wide Thermal Range
Standard FR4 operates reliably up to 130°C. High-Tg variants extend this to 170°C+, maintaining structural integrity in demanding thermal environments such as automotive and industrial applications.
Design Flexibility
Available in 1 to 40 layers with a full range of thicknesses, copper weights, surface finishes, and solder mask colors — FR4 accommodates virtually any PCB design requirement.
Applications
Industries & Applications
Industries
- Consumer Electronics
- Industrial Automation
- Telecommunications
- Automotive Electronics
- Medical Devices
- Power Electronics
- IoT & Smart Devices
- Defense & Aerospace
Typical Products
Smartphones
Laptops
Routers
Smart TVs
Industrial Controllers
Power Supplies
Automotive ECUs
Medical Monitors
IoT Sensors
CCTV Systems
LED Drivers
GPS Modules
Audio Equipment
Test Equipment
Technical Data
Specifications
| Parameter | Capability |
|---|---|
| Layers | 1 —40 layers |
| Board Thickness | 0.2mm —5.0mm |
| Copper Weight | 0.5 oz —4 oz |
| Min Trace / Space | 3 / 3 mil |
| Min Drill Size | 0.15mm mechanical |
| Max Board Size | 600 × 1,200mm |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Hard Gold |
| Solder Mask | Green, Black, Blue, Red, White, Yellow, Matte |
| IPC Standard | Class 2 & Class 3 |
| Tg Options | Standard 130–140°C; High-Tg 170°C+ |
| Bow & Twist | ≤0.75% |
| Lead Time | Prototype: 3–5 days; Production: 7–15 days |