Maximum Component Density
Microvias and fine-line technology allow significantly more components and routing channels per unit area — enabling smaller, lighter end products without sacrificing functionality.
HDI PCB
More circuitry. Less space. Up to 3rd order HDI with laser-drilled microvias for the most advanced designs.
High Density Interconnect (HDI) PCBs represent the cutting edge of printed circuit board technology — enabling designers to pack more functionality into smaller and lighter boards than was previously possible with conventional PCB manufacturing methods.
HDI achieves this through the use of laser-drilled microvias (as small as 0.1mm), blind and buried vias, fine line traces and spaces (as tight as 2.5/2.5 mil), and sequential lamination build-up processes. These technologies dramatically increase routing density, reduce layer count requirements, and improve signal integrity at high frequencies.
We support up to 3rd order HDI — the most complex commercial HDI structure — with three sequential build-up layers on each side of the board core. Any-layer HDI, where every layer can be interconnected via stacked microvias, is also available for the highest density requirements such as advanced mobile processors and high-performance computing modules.
HDI is not just about miniaturisation — it also delivers superior electrical performance. Shorter signal paths, reduced parasitic inductance and capacitance, and better controlled impedance make HDI the preferred choice for designs operating at gigahertz frequencies where signal integrity is paramount.
Key Advantages
Key Advantages
Improved Signal Integrity
Shorter interconnect paths and reduced parasitic effects improve signal quality at high frequencies. Essential for designs above 1 GHz where trace length directly impacts performance.
Reduced Layer Count
HDI routing efficiency often allows the same design to be achieved with fewer layers compared to conventional PCBs — potentially reducing cost and board thickness.
Via-in-Pad Technology
Microvias placed directly under BGA and fine-pitch component pads free up routing space and enable escape routing for the finest pitch components available today.
Support for Advanced Packages
HDI enables reliable assembly of the smallest IC packages — including 0.3mm pitch BGA, CSP, flip-chip, and embedded die — that conventional PCBs cannot accommodate.
Up to 3rd Order HDI
Three sequential build-up layers per side support the most complex designs. Any-layer HDI available for maximum interconnect freedom between all layers.
Applications
Industries & Applications
Industries
- Consumer Electronics & Mobile
- Wearable Technology
- Medical Devices & Implants
- Aerospace & Defense
- High-Performance Computing
- Advanced Automotive (ADAS, EV)
- Telecommunications (5G)
- Industrial IoT
Typical Products
Smartphones
Tablets
Smartwatches
AR/VR Headsets
Hearing Aids
Pacemakers
Avionics Modules
GPU Boards
5G Base Stations
ADAS Controllers
Satellite Components
Drone Flight Controllers
Industrial Cameras
High-Speed Networking Equipment
Technical Data
Specifications
| Parameter | Capability |
|---|---|
| HDI Order | 1st, 2nd, 3rd order; Any-layer HDI available |
| Min Laser Drill | 0.1mm |
| Min Microvia Pad | 0.25mm |
| Min Trace / Space | 2.5 / 2.5 mil |
| Via Types | Blind, Buried, Stacked, Staggered, Via-in-pad |
| Layers | 4 – 30+ layers |
| Board Thickness | 0.4mm – 3.2mm |
| Registration | ±0.05mm |
| Surface Finish | ENIG, ENEPIG, Immersion Silver |
| IPC Standard | Class 2 & Class 3 |
| Controlled Impedance | ±5% tolerance |
| Lead Time | Prototype: 7–10 days; Production: 15–25 days |