Full Turnkey Service
We handle component sourcing, PCB fabrication, assembly, and testing — one supplier, one point of contact, one delivery. Simplifies your supply chain and reduces project management overhead.
PCB Assembly (PCBA)
Full turnkey SMT and THT assembly — from Gerber and BOM to tested, production-ready boards.
PCB Assembly (PCBA) is the process of soldering electronic components onto a fabricated PCB to create a functional electronic assembly. Our full turnkey assembly service covers every stage of this process — from component procurement and incoming inspection through to final functional testing and packaging.
Surface Mount Technology (SMT) is the primary assembly method for modern electronics, placing components directly onto the surface of the PCB using automated pick-and-place machines. We support SMT assembly down to 0201 (imperial) component sizes, with the precision and process control required for fine-pitch ICs, BGAs, QFNs, and other challenging packages.
Through-hole technology (THT) remains essential for connectors, transformers, electrolytic capacitors, and other components that require the mechanical strength of leads through the board. Our mixed assembly capability combines SMT and THT on the same board, with wave soldering and selective soldering available alongside reflow processes.
Quality is verified at every stage. Automated Optical Inspection (AOI) checks 100% of SMT assemblies for component presence, polarity, alignment, and solder quality. X-ray inspection verifies hidden solder joints under BGAs and QFNs. BGA rework capability ensures even the most complex package issues can be resolved without scrapping the board.
Key Advantages
Key Advantages
Components from Authorized Sources
All components sourced from authorized distributors with full traceability. Date codes, lot numbers, and certificates of conformance available on request — no counterfeit risk.
Advanced Inspection — AOI & X-Ray
100% Automated Optical Inspection on all SMT assemblies. 2D and 3D X-ray for BGA, QFN, and hidden joint verification. Every board inspected before it leaves.
BGA Capability & Rework
Placement and soldering of BGA packages down to 0.3mm pitch. X-ray verified before and after. BGA rework and reballing available for engineering changes and field returns.
IPC-A-610 Workmanship Standard
All assemblies meet IPC-A-610 acceptability standards. Class 2 for commercial and industrial electronics. Class 3 available for high-reliability, medical, and aerospace applications.
Prototype to Mass Production
From a single prototype board to tens of thousands of production units — the same quality process, the same inspection standards, the same reliability at every volume.
Applications
Industries & Applications
Industries
- Consumer Electronics
- Industrial Automation & Control
- Medical Devices
- Telecommunications & Networking
- Automotive Electronics
- Aerospace & Defense
- IoT & Smart Devices
- Energy & Power Systems
Typical Products
IoT Gateways
Industrial PLCs
Medical Monitors
Network Switches
ADAS Modules
Drone Controllers
Smart Meters
Security Cameras
EV Battery BMS
Wearable Devices
Audio Electronics
Robotics Controllers
5G CPE Devices
LED Drivers
Technical Data
Specifications
| Parameter | Capability |
|---|---|
| Min Component Size | 0201 imperial |
| BGA Min Pitch | 0.3mm |
| Placement Accuracy | ±0.03mm |
| Max Component Height | 25mm |
| Max Board Size | 600 × 500mm |
| Solder Paste | Lead-free SAC305 & Leaded SnPb |
| Reflow | Nitrogen reflow available |
| Wave Soldering | ✓ Available |
| Selective Soldering | ✓ Available |
| Double-Sided Assembly | ✓ Available |
| AOI Inspection | 100% on all SMT |
| X-Ray Inspection | 2D & 3D available |
| BGA Rework | ✓ Available |
| Conformal Coating | ✓ Available |
| Functional Testing | To customer spec |
| IPC Standard | IPC-A-610 Class 2 & 3 |
| Lead Time | Prototype: 5–7 days; Production: 10–20 days |